New application directions and characteristics of adhesives 02

New application directions and characteristics of adhesives

02 Characteristics of Adhesives

  1. Temperature resistance

Inorganic high temperature adhesives are usually used in the range of 1500-1750℃, while copper phosphate oxide adhesives have a wider temperature resistance range and can be used in the range of 180-1400℃. However, the main aggregates used in inorganic high temperature adhesives are zircon sand and refractory soil. Zircon sand is relatively expensive and mainly relies on imports, and refractory soil must be obtained at the expense of land, which is a huge cost. Therefore, it is imperative to find cheap and easily available products to replace traditional aggregates to reduce production costs. Some organic adhesives have also achieved high temperature resistance through modification. For example, phenolic resin glue modified with B4C can withstand high temperatures of 1500℃. The market demand for heat-resistant adhesives is constantly growing, so this type of adhesive has broad development prospects.

 

  1. Low pollution

As the global environment deteriorates, people are gradually starting to use some environmentally friendly products. Although adhesives are not a large category of chemical products, their harm to the environment cannot be ignored. Those non-environmentally friendly adhesives will gradually be abandoned. Polyethylene formaldehyde adhesive (commonly known as "107 glue") contains free formaldehyde, which is harmful to human health. It has long been banned in developed countries, but in my country, due to its low price, it still has a considerable market share. However, its usage has gradually decreased and will soon be completely eliminated. How to modify non-environmentally friendly adhesives into environmentally friendly adhesives is an imperative task.

 

  1. Non-destructive bonding

The main methods of connecting materials include bolting, riveting, welding and bonding. Although bolting and other technologies can achieve quick connection, they will damage the materials due to hollowing out or local heating of material parts, and stress concentration cannot be avoided during use. In contrast, bonding technology is a non-destructive connection technology, and because the bonding interface bears the load as a whole, it improves the load capacity and prolongs the service life.

 

  1. Lightweight

The density of adhesive is relatively low, mostly between 0.9 and 2, which is about 20% to 25% of the density of metal or inorganic materials, so it can greatly reduce the weight of the connecting material of the adhered object. This has important value in reducing the weight and saving energy in aerospace, aviation, missiles, and even automobiles and navigation.

 

 


Post time: 2024-05-24 16:20:32
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